摘要 :
Continuing functional enhancement of portable consumer and computing products challenges electronics industry OEMs to provide these products in smaller and lighter form factors. This places significant pressure on silicon device v...
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Continuing functional enhancement of portable consumer and computing products challenges electronics industry OEMs to provide these products in smaller and lighter form factors. This places significant pressure on silicon device vendors to increase chip functionality and to place their chips into smaller packages. Significant advances in single chip packaging the last few years met this need, but now the pressure continues, resulting in increased focus on placing multiple chips into a single package.
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